Soldering Technology for QFP Packages

Journal of SHM

Online ISSN : 1884-1198
Print ISSN : 0919-4398
ISSN-L : 0919-4398

Soldering Technology for QFP Packages

Kenichi Otsuka, Ryosuke Kimoto

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JOURNAL FREE ACCESS

1996 Volume 12 Issue 5 Pages 16-23

DOI https://doi.org/10.5104/jiep1993.12.5_16

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Article 1st page

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© The Japan Institute of Electronics Packaging

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Circuit Technology

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Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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