Journal of SHM
Online ISSN : 1884-1198
Print ISSN : 0919-4398
ISSN-L : 0919-4398
Flip Chip Bonding on Epoxy Base Printed Circuit Board
Yutaka Tsukada
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1997 Volume 13 Issue 1 Pages 12-18

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HYBRIDS

Circuit Technology

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Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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