Journal of SHM
Online ISSN : 1884-1198
Print ISSN : 0919-4398
ISSN-L : 0919-4398
Stress Analysis for High Density Packaging
Minoru Mukai, Noriyasu Kawamura, Kuniaki Takahashi
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1997 Volume 13 Issue 5 Pages 23-29

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Circuit Technology

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Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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