The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571
Production Engineering of Micro Connections in Stud-Bump-Bonding Packaging
Koichi KUMAGAI, Akira KABESHITA, Osamu YAMAZAKI
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1995 Volume 10 Issue 6 Pages 368-372

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