Abstract
The surface morphology and the growth process of copper foil for printed wiring boards formed by high speed copper deposition were investigated by means of SEM observation and XRD measurements Concentrations of cupric ion, sulfuric acid, chloride anion and glue, and also current density, bath temperature and flow speed were varied for this evaluation. It was found that the addition of Cl- and glue effectively controls the morphology of copper deposited. Chloride ion promoted pyramidal deposition growth, whereas glue suppressed it. The pyramidal deposition growth was found to correspond to the selective deposition of fcc copper crystals with the ‹110› preferred orientation ( (220) plane) . Under optimum conditions, the copper deposition started with the ‹111› preferred orientation, and after the deposit grew beyond the thickness of 10μm, pyramidal deposition began to form in the presence of chloride ions and glue, corresponding to the growth of crystals with the‹110› preferred orientation.
