The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
Online ISSN : 1884-1201
Print ISSN : 1341-0571
ISSN-L : 1341-0571
Through Hole PWB Technology Utilizing Copper Paste Type PTF
Yoshinari MATSUDA, Toshio TOYAMA
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1997 Volume 12 Issue 4 Pages 214-216

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