抄録
When film or paste of an organic adhesive material, in which metallic balls or flakes of approximately 5μm in diameter have been dispersed, is used as an electrical connection material, the electrical junction is considered to be free from causing environmental pollution and capable of finer-pitch connection than the conventionally-used solder joint electrical connec-tions, and thus has attracted attention. In the past, do resistance has been well verified, and its problem is thought to have been solved. However, in spite of the fact that it is the junction where high frequency pulse signals flow in real applications, its high frequency characteristics have not been verified. The purpose of this study is to make actual measurement of the transmission characteristics of high frequency pulses through this junction and verify the practica-bility of the connection method. Applied pulse was of 2ns rise and fall time. When the peak voltage of the pulses was going down, the interconnection would be unstable in sometime, where points were measured. From this measurement data, it was found that conductive paste would show high-frequency transmission characteristics (over 100MHz) that are trou-ble-free with respect to the connection mesh like network having distances of 50μm or so. The reason for the stability despite the large number of contacts chained together can be deduced from the action of mechanical compressive force due to the resin filling, which resulted in the stable existence of each contact as a metallic (ohmic) contact.
