抄録
The increasing sophistication of information in society and the impending ‘Internet of Things’ will require smaller and higher-performance electronic devices, and faster also signal transmission, Particularly printed circuit board materials, such as cyclo-olefin polymers (COP) and liquid-crystal polymers (LCP), have been drawn attention for their low dielectric properties. Circuitry formation on these materials need plating treatment. Plating techniques on surface-modification using UV irradiation have been reported, but irradiation times of approximately 5 and 10 min, respectively, to achieve sufficient adhesion strength. However, these long treatment times present a challenge to productivity. To address this problem, we performed experiments using an improved, high-power UV lamp, with the aim of reducing the time required for surface modification treatment. We achieved significant reductions in UV-irradiation processing time, achieving an adhesion strength comparable to that obtained by a conventional method by irradiating COP plates for 45 seconds and LCP plates for 75 seconds.
