Proposal of a Temperature Rise Estimation Method for Densely Mounted Components

Yoshinori Aruga; Takayuki Yamabe; Koichi Hirasawa; Hirotoshi Aoki; Tomoyuki Hatakeyama; Shinji Nakagawa; Masaru Ishizuka

doi:10.5104/jiepeng.11.E18-005-1

Technical Papers

Proposal of a Temperature Rise Estimation Method for Densely Mounted Components

Yoshinori Aruga, Takayuki Yamabe, Koichi Hirasawa, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka

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Keywords: Chip Components, Dense Mounting, Thermal Management, Surface Mount, Pad Dimensions, Thermal Network, Estimation Method

JOURNAL FREE ACCESS

2018 Volume 11 Pages E18-005-1-E18-005-13

DOI https://doi.org/10.5104/jiepeng.11.E18-005-1

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Abstract

In this paper, a method for estimating the temperature of densely mounted chip components is discussed. It is assumed that several to dozens of small chip components are mounted in a grid shape and the heat generation of each component is about 0.1 W or less. The temperature distribution and heat flows in the board under various board conditions were investigated by numerical experiments using CFD simulation. Based on the results, a simple estimation formula that can be used for temperature estimation for densely mounted components is proposed.

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