Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Released on J-STAGE: April 25, 2022 | Volume 15 Pages E21-012-1-E21-012-13

Koichi Takemura, Daisuke Ohshima, Akihiro Noriki, Daisuke Okamoto, Akio Ukita, Jun Ushida, Masatoshi Tokushima, Takanori Shimizu, Ichiro Ogura, Daisuke Shimura, Tsuyoshi Aoki, Takeru Amano, Takahiro Nakamura

Transparent Antenna with High Radiation Efficiency and High Optical Transmittance Using Dielectric-metal-dielectric Composite Materials Based on ITO/Ag/ITO Multilayer Film

Released on J-STAGE: July 14, 2022 | Volume 15 Pages E22-001-1-E22-001-7

Fukuro Koshiji, Yoji Yasuda, Yuri Yamada, Katsumi Yamada, Takayuki Uchida

Development of Lift-off Photoresists with Unique Bottom Profile

Released on J-STAGE: March 25, 2016 | Volume 8 Pages 62-67

Hirokazu Ito, Kouichi Hasegawa, Tomohiro Matsuki, Shiro Kusumoto

A Design Method of Compact Lumped-Element Matching Circuits for Diplexers Using SAW Filters

Released on J-STAGE: November 29, 2018 | Volume 11 Pages E17-015-1-E17-015-8

Shinpei Oshima, Tomonori Oshima, Takuto Numao, Koji Wada

Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Released on J-STAGE: October 01, 2020 | Volume 13 Pages E19-017-1-E19-017-11

Dai Ishikawa, Bao Ngoc An, Matthias Mail, Helge Wurst, Benjamin Leyrer, Thomas Blank, Marc Weber, Suguru Ueda, Hideo Nakako, Yuki Kawana