Advanced Boiling Cooling Technology Using a Compact Vessel with a Low Water Level

抄録

There is a strong demand for compact cooling devices that is used for power electronics such as inverters of electric vehicles. Aiming for improving the performance of cooling devices with downsizing it, boiling heat transfer attracts a lot of attention because of its high heat transfer coefficient. However, there is few reports related to subcooled pool boiling using a compact vessel. In this study, to achieve a higher heat flux removing using a compact vessel, subcooled pool boiling was investigated by varying a water level, as well as microbubble emission boiling characteristics. As a result, the experimental result found that the onset of microbubble emission boiling is affected by the water level.