Technical Papers
Extreme Low Interfacial Thermal Resistance Heat Conductive Sheet Design
2019 年 12 巻 p. E18-007-1-E18-007-4
詳細
2019 年 12 巻 p. E18-007-1-E18-007-4
High thermal conductive adhesive having extreme low interfacial thermal resistance was developed for thermal management of power device and modulus. We focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive filler and metal such as Cu or Al. The interfacial thermal resistance was determined by modulus of heat conductive sheet and dispersion of high heat conductive filler. The low modulus sheet and the good dispersed sheet showed lower interfacial thermal resistance. In addition, we investigated the effect of filler size. The larger filler size showed higher heat conductivity and higher interfacial thermal resistance. To consider the effect of those facts, we successfully developed the high thermal conductive sheet with extremely low interfacial thermal resistance. Bulk heat conductivity of the sheet is higher than 10 W/mK. The interface thermal resistance is below 0.009 K/W.
