Design and Heat-dissipation Characteristics of a Novel Spectrally Selective Thermal-radiation Material

抄録

Improvement of heat dissipation from electronics devices is demanded. It has been reported that heat dissipation can be improved by coating thermal-radiation material on the heat element. However, most of radiated heat from the conventional thermal-radiation material is absorbed by an external resin package, resulting in decreased heat-dissipation characteristics. In this report, we newly developed the coating- type spectrally selective thermal-radiation material (C-SSTRM) with emits infrared light through a resin package. C-SSTRM is composed of densely arranged the metallic particles with a specific particle size. The metallic particles are fixed in the resin layer. C-SSTRM was applied to the surface of a heating element, and its heat-dissipation characteristic in a sealed resin case was evaluated. The results of the evaluation confirm that the surface temperatures of the heating element and the resin case were decreased when C-SSTRM was applied compared with the temperatures when the conventional material was applied.