Formation of High-Frequency Adapted Copper Clad Laminates Composed of Syndiotactic Polystyrene Films

抄録

Syndiotactic Polystyrene (SPS) has excellent electrical properties. So it has been strongly expected SPS to apply for Copper Clad Laminate (CCL) for high frequency use. We conducted to fabricate the CCLs using SPS films and electrolysis copper foils by using vacuum lamination process and considered the anchoring effects from mechanical properties of SPS film, copper foil's surface morphologies and XPS analysis. In addition, we examined total line losses for micro-striplines. It was defined that the sufficient anchoring effect resulted from softening of SPS film over Tg and the peel strength depended on the fine nodule shape and the existent of silicon atoms on the copper foil matte surfaces. And it was observed that the correlation between the losses and the size of nodules on them. We specified the suitable electrolysis copper foil for CCLs using SPS films for the high frequency use, which showed both sufficient bond strength and low electrical loss.