Technology and Trend Analysis on High Thermally Conductive Resin-Based Materials for the Future Semiconductor Systems

Abstract

Current advancements required for thermal management technology in semiconductors and electronic devices for systems are quantitatively investigated and analyzed based on statistical text analysis of patents and relevant literature. As aluminum-nitride and boron-nitride fillers exhibit excellent thermally conductive properties for resins, thermal management involving these materials can improve the performance and reliability of future semiconductor devices. Some required specifications such as thermal conductivity in the marketplace are estimated and discussed from a systems perspective.