2022 年 15 巻 p. E22-002-1-E22-002-5
Using the formic-acid type etching solution, when carrying out a spray etching, impedance measurement has been performed for the investigation about the etching process. If the flow rate of spray solution has been set adequately and under stabilization of the status of the patterned copper substrate with a watch-glass placed under a substrate, the impedance measurement data could be obtained without having noise. We could differentiate the equivalent circuit between spray etching and dip etching as reference. Furthermore, we have been able to prove that the Nyquist plot overview under spray etching was different from that under dip etching. We have succeeded in obtaining the impedance data under spray etching first in the world.