Transactions of The Japan Institute of Electronics Packaging
Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365
Technical Papers
The Design Method of Compact Mutiplexer based on New Substrate Integrated Defected Ground Structure
Weiyu ZhouKoji WadaKenichi Ohta
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2023 Volume 16 Pages E23-001-1-E23-001-13

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Abstract

This paper proposes a new structure based on substrate integrated defected ground structure (SIDGS), and uses this structure to construct a compact triplexer with narrow bandwidth. Compared with the previous literatures related to the triplexer, the triplexer formed by this structure has a smaller size. In addition, the structure has good scalability and can be composed of any number of multiplexers without worrying about the coupling between the slots, which has favorable design flexibility. Moreover, the method of designing a multiplexer using this structure is also given, simulated, fabricated, and measured to prove the method's effectiveness.

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© 2023 The Japan Institute of Electronics Packaging
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