Platinum Interconnections for Harsh Environment Applications Using Atmospheric Pressure Sputtering

Abstract

For the atmospheric pressure sputtering technology, directly structured thin- and highly conductive layers of platinum were additively deposited on Al₂O₃ ceramic substrate. The necessary process parameters could be identified and the layers could be contacted reliable by using thin-wire bonding. A subsequent storage for 1,000 h at 500°C shows no degeneration of the mechanical bonding properties.