Transactions of The Japan Institute of Electronics Packaging
Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365
Original Articles
Bandpass Filter Embedded SwP (System with Probe) for High-Frequency Application
Keiji MatsumotoRyota SaitoWoon ChoiHajime Tomokage
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2009 Volume 2 Issue 1 Pages 148-152

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Abstract
A new type of low-temperature co-fired ceramic (LTCC) probes for high-frequency measurements fabricated using SiP technology is proposed. The advantage of this probe is that the metal tips for the electrodes can be made easily by cutting LTCC sheets during the fabrication process. A system with probe (SwP) consisting of a probe and a bandpass filter (BPF) is designed and fabricated. The frequency dependence of the reflection parameter S11 and transmission parameter S21 showed the good agreement between simulation and measurement. Also, the S-parameters of a SwP with a commercial discrete BPF are measured and compared to three types of BPF embedded SwPs. Finally, the near-end crosstalk (NEXT) and far-end crosstalk (FEXT) for a fabricated SwP array are investigated.
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© 2009 The Japan Institute of Electronics Packaging
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