抄録
Boiling heat transfer is a superior heat transfer technology using the latent heat transport with phase-change. However, it has been difficult to employ as a cooling technology for electronics because the unstable transition boiling and film boiling with excessive high temperature are impossible to control. In highly subcooled boiling, the coalescing bubbles formed on the heating surface collapse to many fine bubbles at the beginning of transition boiling and the heat flux exceeds the critical heat flux. This boiling regime has been called Microbubble Emission Boiling (MEB). Two models of cooling device are introduced using subcooled flow boiling with MEB for power electronics, where the maximum heat flux is 500 W/cm2 (5 MW/m2).
