Transactions of The Japan Institute of Electronics Packaging
Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365
Technical Papers
Use Isothermal Surface to Help Understanding the Spatial Representation of Structure Function
Yafei Luo
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2012 年 5 巻 1 号 p. 63-68

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Thermal structure function is a proven methodology to do experiment based structural analysis of heat path inside electronics package or cooling devices. However, how to understand the 3D heat flux structure from a 1D structural function is always the most difficult job for thermal engineers. In this article, 3D CFD software is used to describe the transaction image from 1D structure function to 3D heat flux distribution.
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© 2012 The Japan Institute of Electronics Packaging
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