Thermal Transient Test Based Thermal Structure Function Analysis of IGBT Package

抄録

In this article an IGBT package is measured using thermal transient test method following JESD 51-14 standard. In order to study the thermal structure in the package, a detailed CFD (Computational Fluid Dynamics) simulation model is also created and calibrated against the physical device using structure function. By the calibrated CFD model the package’s thermal behavior is studied. The purpose of this paper is to illustrate the process of calibrating CFD model to get a "thermally identical" representation of physical devices.