Abstract
In this study, we are going to report on development of conductive copper paste curable in air. The copper paste was prepared by a simple and facile method using copper powder with resin and additives such as tri-ethanolamine (TEA) and liquid fatty acid. The prepared copper paste was screen-printed on an alumina substrate, then cured at 210°C for 10 min in air to obtain cured copper product. The resistivity of the product with additives was less than 6.0 × 10-5 Ω∙cm. Without the additives, the resistivity was 7.1 × 10-4 Ω∙cm, it was higher than the case of with additives. These results indicate that TEA and liquid fatty acid interact with each other in the copper paste, and then the resistivity is decreased. Furthermore, the copper pastes using a liquid fatty acid and TEA had longer "pot life" than that of the other copper pastes.
