Abstract
In this paper, we investigate reliability testing for a glass interposer. The test vehicle includes a glass interposer with a chip substrate and a bismaleimide triazine (BT) substrate. The structure of a glass interposer with two redistribution layers (RDLs) on the front-side and one RDL on the back-side has been evaluated and developed. Key technologies, including via fabrication, front-side RDL formation, microbumping, temporary bonding, glass thinning, and back-side RDL formation, have been developed and integrated for high performance. The BT substrate design for electrical characterization of reliability tests is reported in this paper. The results indicate that this glass interposer can be effective for the assembly of thin substrates. The data shows the feasibility of this glass interposer for electronics applications.
