Retraction of "Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications" [Transactions of The Japan Institute of Electronics Packaging, Vol. 9, pp. E16-007-1–E16-007-6]

Maciej Patelka; Noriyuki Sakai; Cathy Trumble

doi:10.5104/jiepeng.9.Retr01_1

Transactions of The Japan Institute of Electronics Packaging

Online ISSN : 1884-8028
Print ISSN : 1883-3365
ISSN-L : 1883-3365

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Retraction

Retraction of "Development of a Ag/glass Die Attach Adhesive for High Power and High Use Temperature Applications" [Transactions of The Japan Institute of Electronics Packaging, Vol. 9, pp. E16-007-1–E16-007-6]

Maciej Patelka, Noriyuki Sakai, Cathy Trumble

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2017 Volume 9 Pages Retr01_1

DOI https://doi.org/10.5104/jiepeng.9.Retr01_1

J-STAGE : jiepeng 9 0 pp.E16-007-1-E16-007-6

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