軽金属
Online ISSN : 1880-8018
Print ISSN : 0451-5994
ISSN-L : 0451-5994
Al-4%CuおよびAl-4%Cu-0.065%Sn合金の時効曲線におけるプラトー段階での時効挙動
鈴木 寿菅野 幹宏伊藤 吾朗
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1979 年 29 巻 4 号 p. 153-158

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Isothermal aging curves on the logarithmic scale of many aluminum-base alloys have the plateau of flat region. Physical meaning of the plateau is still ambiguous. The work on this subject was undertaken for electrical resistivity change vs. log t (t: aging time) curves in Al-4%Cu and Al-4%Cu-0.065%Sn alloys from the viewpoint whether the precipitation is exactly checked at the plateau. The precipitation is not checked at the stage. The size and the amount of G. P. zones continuously increase through the stage. The plateau in semi-logarithmic aging curves is only apparent one and would have no physical meaning.

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