2004 年 68 巻 8 号 p. 511-514
The pulse electric current bonding (PECB) process, also called plasma activated sintering (PAS) or spark plasma sintering (SPS) by some researchers, has received much attention as one of the most advanced materials bonding processing in recent years.
In this work, we studied the effects of the initial electric current, which is the current in early bonding stage, on the bond quality (tensile strength, reduction of area, and bonded area ratio). The following results were obtained. When the initial electric current was high, local heating of the contact area was accelerated and the bond quality of the joints was better. However, initial current had the optimum value and it was necessary to choose the condition that the contact area at bonded interface does not melt locally. When the molten metal layer was formed on the contact area, it was migrated to the center of the bonding surface by the pinch effect. This phenomenon generated unhomogeneous heating of the bonding surface. Therefore, the bond quality of the joints was worse.