置換めっき法によりCu基板上に形成されたPd-Cu合金膜の構造
2005 年 69 巻 5 号 p. 429-432
詳細
2005 年 69 巻 5 号 p. 429-432
In the present study, the microstructure of substitutional-deposited Pd-Cu film was investigated. Results show that the composition of Pd-Cu substitutional-deposited film was Cu-16~18 at%Pd. High resolution TEM image and XRD measurements results shows that the Pd-Cu film consist of Cu and intermetallic compound (Cu3Pd). Cu3Pd intermetallic compound was existed at as-deposited film. The morphology of initial deposited Pd-Cu film was affected by crystallographic structure of Cu substrate.
