合金としてのウィスカ抑制Pbフリーはんだ

抄録

  Electronic products with Sn-Pb solder are being now excluded due to the harmful effect of Pb on the environment. Generally, Sn-Ag-Cu solder is used in place of Sn-Pb solder. In the solder joint, acicular crystals called whiskers often grow. Whiskers often cause a short-circuit problem in a fine-pitch solder joint. In this study, several lead-free solders added with a small amount of various elements were prepared to investigate the effectiveness validity of added elements in restraining whisker growth. The elements effective in inhibiting whisker growth were identified.