抄録
The processes of recovery and recrystallization in oxygen-free copper were observed in detail in the same area of a specimen using an SEM(scanning electron microscopy)-EBSD(electron back scatter diffraction) system. Specimens were solution heat-treated at 823 K for 3.6 ks. Then, the specimens were cold-rolled at a reduction rate of 75%, and subsequently, annealed at 523 K. Intermittent annealing using a salt bath, Ar+ ion-polishing and EBSD measurement were repeated. High and low angle boundaries were induced by cold-rolling. Prior grain boundaries were observed with a relatively high contrast, which allows one to observe the strain-induced grain boundary migration(SIBM). Dislocation cells surrounded by high-angle boundaries grew into recrystallized grains without any change in their orientations. In addition, recovery structures grew owing to the migration of high-angle boundaries. The migration of high-angle boundaries did not always lead to the formation of recrystallized grains but resulted in the growth of the recovered region. These behaviors were similar to those observed during recrystallization on an Al-Mg-Si alloy and commercial pure aluminum. Such recrystallization generally occur in metals and alloys in which dislocation cells are formed upon deformation by cold-rolling.
