抄録
The purpose of this paper is to develop a new long-life electrical contact. The ability of copper-reductant composite by which the reducing agent with a size of 50 nm or less was distributed inside to extend a sliding life as a slide member for electrical contact was studied. After investigating that L-ascorbic acid as a reductant reduces cupric oxide to copper at room temperature, formation of the copper-reductant composite was tried by the composite plating using the aqueous solutions of a mixed-ligand copper(II) complex with L-ascorbic acid and 1,10-phenanthroline. In the obtained composite film contact, L-ascorbic acid as a reductant and 1,10-phenanthroline were probably distributed in 20 nm or less size, and the sufficiently longer sliding life was shown in slide testing than the plated copper film contact.
