溶融銅の表面張力に及ぼす硫黄の影響

抄録

The effect of dissolved sulphur on the surface tension of liquid copper has been measured by the sessile drop method at 1114°, 1200°, 1300° and 1340°C. Sulphur is highly “surface active” in liquid copper, and at a sulphur content of 0.6%, the surface tension is lowered by about 620 dyn·cm⁻¹ at 1114°, 580 dyn·cm⁻¹ at 1200°, 530 dyn·cm⁻¹ at 1300° and 470 dyn·cm⁻¹ at 1340°C, respectively. The degree of adsorption of sulphur on the liquid copper surface has been calculated and the result indicates that the maximum surface excess of sulphur is about 1.6×10⁻⁹ mol·cm⁻², which corresponds to a mono-molecular layer of Cu₂S or S⁻⁻.