1970 年 34 巻 7 号 p. 690-696
The interfacial transition from plane to cellular structure and the segregation pattern of Al-Cu alloys was investigated by means of a quenching method during unidirectional solidification.
The following results were obtained:
(1) The preferred grain boundary segregation occurred prior to the breakdown of the planar interface.
(2) Small holes appeared at random on the solid-liquid interface at the beginning of the transition.
(3) The holes were aligned or distributed regularly to form an elongated cell.
(4) The solidification proceeded entrapping the liquid phase at the bottom of the holes and resulted in the “rosary-like” segregation.
(5) The “rosary-like” segregation was also observed in hexagonal cell nodes.