溶融Cu-Sn合金の表面張力および密度
1973 年 37 巻 6 号 p. 668-672
詳細
1973 年 37 巻 6 号 p. 668-672
Surface tension and density of liquid Cu-Sn alloys were measured by the maximum bubble pressure method and also by the sessile drop method. Values of density agreed well with those obtained by previous investigators. Surface tension of liquid copper was slightly higher than values obtained by previous investigators, but that of liquid tin was nearly the same as those given in the literature.
Surface tension of liquid copper decreased remarkably by the addition of tin. The temperature coefficient of surface tension was positive over the composition range from 30 to 50% Sn and was maximum at 32% Sn. Presumably, this resulted from the dissociation of clusters in the liquid alloy with increase in temperature.
