Reaction Diffusion in the Cu-Ti System

Abstract

Reaction diffusion between pure Cu and Ti has been studied in the temperature range from 963 to 1143 K. Formation of six intermetallic compounds, Cu₄Ti, Cu₂Ti, Cu₃Ti₂, Cu₄Ti₃, CuTi and CuTi₂, has been observed in the diffusion zone, as predicted by the equilibrium phase diagram of the Cu-Ti system.
The layer thickness of these intermetallic compounds except Cu₄Ti has been found out to obey the parabolic law, showing that the growth of the phase layer has been controlled by diffusion process. Above 1083 K the growth of the Cu₃Ti₂ phase has been observed after an incubation time.
The temperature dependence of the growth rate constants of Cu₄Ti₃, CuTi and CuTi₂ phase layers has satisfied the Arrhenius relationships.