In order to determine the solid-liquid interfacial tension and its temperature dependence of the W-Cu system, the contact and dihedral angles were measured by multiphase equilibrium experiments in the range of temperature, 1573∼1873 K.
In these experiments, the contact angle at the solid-liquid-vapour line was determined by the sessile drop method. The dihedral angle (φ
SL) at the grain boundary groove in contact with liquid was determined from the SEM microstructure of liquid-phase sintered materials, and the dihedral angle (φ
SV) at the groove in contact with vapour was determined from the groove configuration trace by a SEM height meter.
The temperature dependence of the solid-liquid interfacial tension determined (σ
SL) was examined together with those of the grain boundary tension (σ
SS) and surface tension (σ
SV) of solid tungsten.
The following results have been obtained:
(1) The contact angle was 5° at 1473 K. At temperatures higher than 1573 K spreading of copper took place and the contact angle was estimated to be 0°.
(2) φ
SL and φ
SV were 85.3-95.0° and 143.7-144.3°, respectively. Both values decreased with an increase in temperature.
(3) A plot of σ
SL against temperature shows a linear relationship as represented by the following equation:
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oindentThe experimental error of σ
SL was in ±5% and d(σ
SL)⁄d
T was −0.63±0.03 mN/(m·K).
(4) The temperature dependence of σ
SS and σ
SV can be represented by the following linear relationships:
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\
oindentIn the above equations d(σ
SS)⁄d
T and d(σ
SV)⁄d
T were −0.49±0.02 and −0.91±0.03 mN/(m·K), respectively.
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