1994 年 58 巻 6 号 p. 596-604
In order to clarify the effect of active slip systems on the recrystallization along/near the grain boundaries, three kinds of 99.99 mass% copper bicrystal specimens, which have the same original grain boundary and different tensile directions, were prepared.
When they are deformed in tension to a strain of 0.3, the grain boundary is changed into different ones because of the operation of different slip systems. After annealing the recrystallization along/near the grain boundary occurs mainly due to 〈111〉 rotation mechanism in the bicrystal in which multiple slips of dislocations with large screw components on a certain slip system and those on other ones take place. In contrast, the strain induced grain boundary migration mechanism operates in the bicrystal whose grain boundary plane is parallel to edge dislocations entered into and piled-up toward the grain boundary.