磁界・回路連成電源効率解析の電源用SiPへの適用
2006 年 32 巻 p. 144-148
詳細
2006 年 32 巻 p. 144-148
In this paper, we presented the simulation coupling magnetic field analysis and circuit analysis for power module. Parasitic impedance and MOSFET device were modeled for SPICE simulation. We applied the simulation for System in Package (SiP) power module and showed that efficiency and voltage waveform could be calculated with high accuracy.
