抄録
Bonding between laboratory light-cured composite and surface treated Au-Ag-Pd alloy was investigated using newly developed 4-META/MMA-TBB opaque resin. Shear bond strength after 20, 000 thermocycles obtained from heated alloy with this method was 25.1 MPa. Ion-coated specimen showed 25.6 MPa after 50, 000 thermocycles with decrease in bond strength being small. Ferric chloride treated specimen, however, detached from alloy-opaque interface with lowest bond strength. An X-ray photo-electron spectroscopic analysis of ferric chloride treated specimen reveaed increase in silver chloride and oxide, which affected bonding between opaque resin and Au-Ag-Pd alloy.
