抄録
A fundamental study on a method that uses electrodeposited copper foil to measure cyclic compressive load was carried out in this report. When copper foil is adhered to the side of a cylindrical element inserted in a contact area, grain growth is caused by cyclic compressive stress. A basic equation among grain growth density, compressive stress amplitude and number of cycles is derived in this report. If the increasing rate of grain growth is arranged by compressive strain amplitude, the relationship between them does not depend on the material of the cylinder. If some materials are chosen as the cylindrical element, the grain growth occurred in a wide range of compressive stress amplitudes. This means that a wide range of compressive load can be measured without changing the shape of cylindrical element.