抄録
In this article, a new materials test technique for a micron-size beam specimen is described. We have designed and developed the materials test equipment. The specimen that was designed in consideration of a microelectromechanical systems mirror device consists of a mirror, two torsion beams, and a frame. The specimen was made of single crystal silicon fabricated by deep reactive ion etching. The combination of loading point and with or without rotation support enables us to carry out three different types of material tests that are pure torsion, torsion-bending combination, and doubly-clamped beam bending tests. The fracture strength was measured, and the influence of deformation modes on the strength was discussed.
