抄録
Some metal thin films, for example, an Al thin film of about 1 to 2 μm thickness, are delaminated with bending like a polygonal shape during micro cutting. Several samples of Al thin film on Si wafer and some glasses were prepared and the relation between horizontal force and delamination phenomenon during micro cutting was studied. In addition, the possibility to develop quantitative adhesion test by using micro cutting method was considered. As a result, films were delaminated when the horizontal force reached at the critical force and the approximate delamination area was able to be calculated from the relation between horizontal force and delamination phenomenon. But to establish quantitative adhesion test by using micro cutting method, developing the method of evaluating the energy used only for delamination in the total energy provided by cutting blade is needed. Furthermore, to validate the evaluated energy by comparing with the one from other adhesion test, techniques of making samples those are used correctly in different adhesion tests are important.
