抄録
Pattern formation technology by powder paste and photo resist is reported. Fine pattern formation as well as pattern formation with plural materials are discussed respectively. In the fine pattern, the photo resist pattern was formed on a glass substrate by photo process and silver paste was filled in the pattern by a metal blade. After peeling the photo resist, the silver pattern was obtained. The minimum pattern width was 10 μm. In the plural materials formation, ferrite as a magnetic, LTCC (Low Temperature Cofired Ceramic) as a nonmagnetic and silver as a conducting material were applied. A dry film of photo resist was formed on a base film and patterned. The ferrite pattern was formed on the base film in the same manner. Preparing the patterned dry film beforehand, it was laminated on the ferrite pattern. Filling LTCC and silver paste successively, the pattern composed of plural materials of ferrite, LTCC and silver was formed. In the formed LTCC pattern, the thickness of center was thinner than that of peripheral part. In order to achieve further fine patterning and precise structure, it is considered that less adhesion of the paste and the photo resist material is important.
