一般投稿
Langmuir-Brojett 膜で防食した錫はんだの銅板に対する接合強度
2022 年 67 巻 4 号 p. 141-142
詳細
2022 年 67 巻 4 号 p. 141-142
The author investigated the adhesion strength of tin solder with Langmuir-Brojett film and found that the strength is smaller than that of bare tin sample in case of carbon layer being formed on the solder/substate interface.
