2008 Volume 50 Issue 2 Pages 181-186
Single-step self-etch adhesive systems have been developed to simplify and shorten bonding procedures. With the gain in popularity of these simplified systems, their reliability has become a focus of interest. The purpose of this study was to determine the effect of adhesive application method on enamel bond strength. Two commercial single-step self-etch adhesive systems, Clearfil tri-S Bond, and G-Bond, were used. Bovine mandibular incisors were mounted in self-curing resin and the facial enamel surfaces were ground wet on 600-grit SiC paper. Adhesives were only applied without agitation (inactive) or were agitated by a brush (active), and resin composites were condensed into the mold on the enamel surface and light-activated. Ten specimens per test group were stored in water at 37°C for 24 h, then shear-tested at a cross-head speed of 1.0 mm/min. Two-way ANOVA followed by the Tukey HSD test were used. The bond strengths for active application were higher than those for inactive application. Significant differences were found for both adhesive systems. From the results of this study, active application of single-step self-etch adhesive may help to ensure the creation of a roughened enamel surface and enhance the penetration of resin monomer into the subsurface demineralized enamel. (J. Oral Sci. 50, 181-186, 2008)
