Electrodeposition of Cu was conducted in a synthetic electrorefining solution to investigate the effect of gelatin, thiourea and chloride ions on the polarization curve for Cu deposition, morphology, texture, surface roughness and the throwing power of the deposited Cu. In a solution containing both gelatin and chloride ions, the cathode potential for Cu deposition was significantly polarized at current densities above 200A/m2, while the thiourea depolarized the potential for Cu deposition at 200 to 1000A/m2. In a solution containing the three additives, i.e. gelatin, thiourea and chloride ions, the potential for Cu deposition was polarized at 500A/m2. It is supposed that the synergistic effect of gelatin and chloride ions on the polarization prevailed over the depolarization effect of thiourea. In the Cu deposited at initial stage, the chloride ions promoted the field-oriented texture with the orientation of <110> direction. However, Cu deposited at initial stage from the solution containing gelatin, thiourea and chloride ions was composed of both the inclined texture type and the epitaxial growth type of crystals. The surface roughness and throwing power of the deposited Cu was most improved in the solution containing gelatin, thiourea and chloride ions, showing the synergistic effect of three additives. The thiourea had an effect on decreasing the surface roughness of the deposited Cu, and chloride ions improved the throwing power of Cu.
