Abstract
We performed dynamic EBSD measurements on a copper plate under tension, compression, bending, and heating. And we observed the dynamic change behavior of crystal orientation with each method.
We confirmed following things, the relationship between the tensile direction and crystal orientation affects the tensile behavior, soft copper plates exhibit greater susceptibility to distortion during compression compared with hard copper plates, distortion occurs along grain boundaries when bent and suddenly grain size growth occurs when raised to a certain temperature. We also found that when a hard copper plate is bent, distortion occurs first on the outside and then on the inside, that on inside. Also, upon heating, certain additive elements migrate toward the surface..
