磁場と電場の同時印加によるMCF研磨の加工除去量の特性

抄録

　The objective of this study was to derive an empirical expression for the amount of polishing removal in the case of simultaneous application of magnetic and electric fields using MCF (magnetic compound fluid) processing fluid. In the experiments, a polishing apparatus using disk-shaped permanent magnet tool, a parallel-disk type polisher that enable simultaneously apply magnetic and electric fields, which were developed for this study, and parallel-disk type rheometer that enable apply magnetic field were used. Using these experimental apparatuses, it was shown that the amount of polishing removal in the case of simultaneous application of magnetic and electric fields on the MCF processing fluid is related to the superposition of the processing pressure due to the magnetic field and the processing pressure due to the electric field.