The 60th JSAP Spring Meeting 2013
Session ID : 27p-G9-2
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 60
Location : [in Japanese]
Date : March 27, 2013 - March 30, 2013
Bumpless 3D Interconnects for the Tera-scale Bandwidth and High Density Devices Equivalent to <10nm Node Scaling
Details
Article 1st page
