The 75th JSAP Autumn Meeting 2014
Session ID : 18p-A19-14
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Autumn Meeting
Number : 75
Location : [in Japanese]
Date : September 17, 2014 - September 20, 2014
Wafer level vacuum packaging by anodic bonding with aluminum thin film
*Satoshi Karasawa, Takeshi Sugiyama, Tange Yoshihisa, Hideshi Hamada, Yoshifumi Yoshida
Author information
Keywords:
18p-A19-14
Details
Article 1st page
